Silicone wafer：The diameter of silicon carbide wafers we produce ranges from 150 mm to 200 mm. We can also provide 300 mm silicon carbide wafers with a thickness of 350 meters. 350µm (n-type, 3″ SI), 500µm (SI). From the perspective of polishing, we can provide single–ided or double–ided polishing, depending on your needs. In general, we have a large number of stocks and also provide customized services.
Free Standing gan Wafer | Single Crystal Substrates
Si Doped Undoped Laser Device Gallium Nitride Wafer
300mm Gan Wafer | Gallium Nitride Wafer For Power Micro LED
8 Inch 12 Inch 6Inch gan Wafer
2 Inch 4 Inch GaN Wafer | Gallium Nitride Wafer
4inch 6inch GaN-ON-SiC EPI layer
silicone wafer is a thin piece of semiconductor material, usually its element is silicon, which is used to manufacture microelectronic devices.
The process of making silicone wafer from solar cells, transistors and integrated circuits starts from the purification of silicon, which is the most abundant in the crust.It usually exists in the form of silicon dioxide and is used in microelectronic devices. It must be purified and reduced to elements silicon.
These silicon wafers are used as substrates, which are patterned by various materials through photolithography, and then used to create the required circuit structure to build microelectronic devices. Usually, the rules obtained in the process are melted and pulled into a long and thin rule, and then cut into thin pieces with a saw.
Once the silicone wafer is cut, it needs to be polished to a high degree of smoothness. This is a mechanochemical polishing process, which is crucial for the entire process, because this year’s surface roughness will affect the performance of the microelectronic devices. After polishing, this year’s surface roughness will be cleaned to remove any pollutants that may affect the construction equipment.
The next step is photolithography.And use a bright chemical called photoresist to transfer the pattern to the gold source. The photoresist uses light to project the pattern onto the gold source, and then exposes the photoresist to light to make it hard or soluble, depending on the type of photoresist used.
Then develop the gold garden, which includes rinsing the photoresist part that is not protected by light and leaving the pattern of photoresist on the wafer.
Then gold sources with patterns can be processed in the next step, that is, the achievements of various materials, which are the results of picturesque meteorology or physical vapor deposition completed by various technologies, will determine the materials of achievements and the rational ideal characteristics generated.
These materials are used to create various mature stores and interconnection and insulation layers of microelectronic devices.
After the various layers have been deposited, the silicone wafer is then ready for the final step, which is etching.
This involves removing the excess material that is not part of the desired circuit structure, using techniques such as wet etching or dry etching.
Once the etching is complete, the wafer is divided into individual microelectronic devices, which are then packaged and assembled into the final product.
The silicone wafer is used as the base for manufacturing microelectronic devices. It is made by slicing and polishing the regulations, and then using photolithography and various statistical technologies to make patterns on its surface and inherit various materials to make the final surplus materials etched.
Therefore, to create the required circuit structure, wafer will be divided into independent devices, packaged and assembled into the final product.