Their uses and functions are mainly reflected in the following aspects:

The manufacture of silicon wafers can be summarized into three basic steps: silicon purification, single crystal silicon growth and wafer molding.

Through a series of complex process steps, including photolithography, etching, ion implantation, deposition, etc., the required circuit structure and components are formed on the surface of the wafer.

Carrier of technological progress: With the continuous advancement of semiconductor technology, the size of wafers has gradually increased, while the size of components on the chip has continued to shrink.

It is made of high-purity silicon, in the shape of a round thin sheet, with a thickness of about 1 mm or less.