wafer thickness
As the base material for integrated circuits, silicon wafers are manufactured with the utmost precision and purity at every step of the process, from raw material to finished product, and each step of the process is integral to ensuring the high performance and reliability of semiconductor devices.
wafer thickness
Cleaning and Surface Preparation
Includes etching and polishing steps designed to remove unevenness and contaminants generated during the cutting and grinding process.
Chemical etching and atomic-level cleaning processes are used to ensure that the wafer surface achieves ultra-high purity and smoothness, providing an ideal substrate for chip fabrication.
Dicing Process
Silicon ingots are cut into thin discs, or wafers, with thicknesses ranging from 0.2 mm to 1.5 mm using ID saws or finer wire sawing techniques.
This process requires extreme precision, with a single silicon ingot yielding hundreds of wafers. After the initial cut, thinner blades perform precision cuts to ensure accurate separation of each wafer.
Polishing and Customization
Wafers are precision polished to achieve a mirror-smooth surface, a process that combines chemical and mechanical action to further minimize surface defects.
In addition, the market offers a wide range of high-resistance wafers, covering different growth methods, sizes, orientations and thicknesses to meet specific application requirements.
