wafer process
Crystalline silicon wafers are grown at high temperatures and have a very homogeneous crystal structure, which helps to manufacture semiconductor devices with stable performance.
wafer process
Monocrystalline silicon is the most commonly used semiconductor substrate material with the following characteristics:
1. High purity: monocrystalline silicon wafers require high purity, and this high purity ensures that the impurity content in the wafers is very low, which is conducive to the manufacture of high-performance semiconductor devices.
2. Crystal structure: monocrystalline silicon has a regular lattice structure that allows the free flow of electrons, which is the key to realizing high-performance electronic devices.
1. Preparation method: monocrystalline silicon is usually produced by the Czochralski process or the Float Zone process.
2. Silicon wafers with different properties can be manufactured according to specific needs.
3. Doping: monocrystalline silicon can be doped with different elements (such as boron, phosphorus, arsenic) to form N-type or P-type semiconductors.
4. Very wide range of applications, monocrystalline silicon substrates are widely used in integrated circuits, solar cells, power devices and other fields.
5. Size: monocrystalline silicon substrate size is usually 200mm, 300mm or 450mm diameter, depending on the manufacturing process and equipment.
