the wafer
The wafer dicing process flow, also known as the scribing process, involves several key steps to ensure that the wafer maintains its integrity and quality during the dicing process.
the wafer
Testing Standards
Wafer production and testing follow strict industry standards, such as those set by Semiconductor Equipment and Materials International (SEMI). These standards cover a wide range of wafer physical dimensions, surface defects, cleanliness, thickness and warpage.
Advantages and Challenges of Large Wafer Sizes
While an increase in wafer size does not mean absolute superiority, it does lead to higher productivity and cost effectiveness. Large-size wafers are able to accommodate more chips, thereby reducing the production cost of each chip and improving economic efficiency in mass production.
Therefore, when choosing the appropriate wafer size, it is necessary to consider the technology maturity, cost, market demand and application areas.
