Ingot Growth The production of silicon ingots first involves melting and growing high-purity silicon material into crystals, which can be more than 2 meters long and weigh hundreds of kilograms. The purity of their crystal structure is a key measure of success, as any minute impurity can significantly affect the performance of the final electronic product. Flat and Groove Grinding For precise alignment, the silicon ingots undergo a planar or notch grinding process. This stage is similar to the precise alignment in gemstone cutting, ensuring that the specific crystal faces of the silicon crystal perfectly match the direction of the cut, emphasizing the importance of the orientation of the silicon crystal structure. Edge Grinding The edges of cut wafers often have micro-cracks, which are smoothed by the edge grinding technique, not only enhancing the physical strength of the wafers, but also eliminating potential defects and laying a solid foundation for subsequent processes.