Silicon wafer production process : Epitaxial Growth : In some applications, a thin epitaxial layer needs to be grown on a silicon wafer to meet specific electronic or optical performance requirements.
Packaging: Qualified wafers are dust-packed after final cleaning, ready for delivery to chip manufacturers for subsequent IC fabrication. Wire cutting, especially diamond wire cutting, is an indispensable part of modern wafer production, which directly affects the dimensional accuracy, surface quality and production efficiency of wafers, and is one of the key technologies in the wafer production process.