silicon wafer price
At the same time, in response to the diameter fluctuations caused by the thermal effect of the growth of straight-drawn monocrystalline silicon rods, we implement the OD rounding process to ensure that the diameter of the rods is uniform and the surface is smooth. Slicing process: Under tightly controlled conditions, we cut the treated rods into extremely thin wafers. This step is critical for precise thickness control, as there are specific requirements for wafer thickness in solar cells and integrated circuits.
silicon wafer price
Edge optimization – chamfering: After slicing, we chamfer the edges of the wafers, rounding them off to reduce stress concentrations at the edges, prevent cracks and reduce the risk of damage during subsequent processing. Next, through a fine grinding process, we remove saw marks and surface damage from the slicing process to improve the flatness and parallelism of the wafers. For very demanding applications, such as integrated circuit manufacturing, we also use CMP technology to polish the wafer surface to nanometer levels of finish and flatness. Cleaning and Preparation: After chemical etching removes the damaged layers, we thoroughly clean the wafer surface to ensure that there are no impurities left on the wafer surface, providing a pure substrate for subsequent circuit patterning.
