silicon wafer polishing
The wafer polishing process flow is one of the key steps in wafer production, aiming at removing the damage layer on the surface and achieving a high degree of flatness and finish on the wafer surface.
silicon wafer polishing
The difference between polished and unpolished silicon wafers
The surface of polished silicon wafers has higher flatness and smoothness, and can almost reach mirror finish; it can meet the strict requirements for surface quality in integrated circuit manufacturing.
The surface of unpolished wafers may have scratches and defects such as roughness and unevenness, affecting the subsequent processes.
The surface roughness of the polished wafer is significantly reduced, which is favorable for operating the chip lithography, coating and so on. Unpolished wafers have higher surface roughness, which may affect the accuracy and reliability of subsequent processes.
The polishing process removes impurities and residues from the surface and improves the cleanliness of the wafer. Impurities may remain on the surface of the unpolished wafer, affecting subsequent processes.
