Among them, the straight drawing method has become the mainstream in the industry because it can precisely regulate the oxygen content and enhance the mechanical strength of silicon wafers. This step lays the foundation for high wafer quality. Finishing and preparation of the wafers: Subsequently, we use diamond wire saws or high-efficiency belt cutters to accurately remove the irregularities at the ends of the wafers, i.e., to “square off” them in preparation for subsequent slicing operations.