silicon wafer fabrication process
Silicon wafer fabrication process: Through the comprehensive application of the above principles, the wafer cleaning process is able to achieve efficient and thorough cleaning effect, laying a solid foundation for the subsequent process of semiconductor manufacturing.
silicon wafer fabrication process
Physical vibration effect: With the help of ultrasonic and megasonic technology, high-frequency vibration produces a strong cavitation effect in the liquid. These tiny bubbles in the explosion of the impact generated by the force, can be strongly peeled off the silicon wafer surface attached to the large particles of pollutants and difficult to remove stubborn stains. High-temperature vacuum purification method: High-temperature treatment of silicon wafers in a highly vacuumed environment. This step not only effectively isolates the external dust from re-contamination, but also promotes the rapid evaporation and pyrolysis of adsorbed substances on the surface of the wafer, which further enhances the cleanliness of the surface.
