silicon wafer cleaning
Silicon wafer cleaning: Wafer cleaning plays a critical role in the precision process of semiconductor manufacturing, focusing on the elimination of various types of contaminants on the wafer surface, such as particles, organics, and metal ions, to ensure that the surface is clean and flawless, laying a solid foundation for subsequent processing.
silicon wafer cleaning
Wafer cleaning, as the core link in the semiconductor manufacturing process, its core objective is to completely remove particles, organic residues and metal ions and other impurities attached to the surface of the wafer to ensure that the surface reaches the ultimate state of purity, and thus meet the stringent standards of the subsequent precision machining process. The following are the main principles on which wafer cleaning is based and how it is implemented: Overview of cleaning principles: Chemical complexation mechanism: This process makes clever use of selected chemical reagents such as ammonia and hydrogen peroxide, which react with heavy metal ions on the wafer surface to form stable complexes that effectively strip and remove these harmful impurities.
