silicon wafe
Silicon wafer thickness of about 1 millimeter (mm) or less, common silicon wafers in accordance with the diameter is divided into 6 inches (150mm), 8 inches (200mm), 12 inches (300mm) and 18 inches (450mm) and other different specifications.
The standard thickness of the wafer is 0.675mm, 0.75mm and 0.775mm, respectively. The thickness of the wafer needs to be sufficient to ensure mechanical strength, but not too thick, in order to control the cost and improve the output rate of the chip.
silicon wafe
The manufacturing method of silicon wafers mainly includes the following steps:
Purification: The silicon raw material is first purified at metallurgical level to convert silicon oxide into silicon with a purity of over 98%.
High purity polycrystalline silicon is melted to form liquid silicon, and then contacted with single crystal silicon seed and liquid surface, and slowly pulled upward while rotating.
During this process, the silicon atoms are neatly aligned according to the arrangement of the monocrystalline silicon seed, forming a monocrystalline silicon pillar.
The columns are then sliced horizontally with a diamond knife into wafers, which are then polished to form the silicon wafers required for chip manufacturing.
