silicon substrates
Highly brittle, requiring special handling and packaging techniques to ensure reliability. Bonding to semiconductor materials is challenging and can cause interface stress issues. Manufacturing processes and industry standards are still in the developmental stage, and long-term reliability validation will take time. Transparency may be a limitation in some specific package designs, and current capacity and production volumes need to be increased.
silicon substrates
High Flatness and High Density Routing: Glass substrates have extremely high surface flatness, supporting high precision patterning and high density routing for high density packaging and advanced integrated circuits.
Excellent Thermal Stability and Electrical Performance: A coefficient of thermal expansion similar to silicon reduces thermal stress, which, combined with its excellent electrical insulation properties, enhances package reliability.
New Opportunities from Transparency: The transparency of glass substrates is uniquely advantageous in optoelectronics, co-packaged optics and sensor applications, facilitating the development of optical communications and optical sensing technologies.
Cost-effectiveness and productivity: Large-size glass substrate design improves wafer utilization and reduces unit cost, while the rectangular shape optimizes productivity.
Design Flexibility: Support for embedded inductors, capacitors and other components provides new ways for power management optimization and low power design.
