silicon chip substrate
Silicon chip substrates, as a core component of semiconductor technology, are mainly composed of silicon (Si), whose semiconducting properties are particularly suitable for the manufacture of integrated circuits. Thanks to its excellent thermal stability and electronic properties, the silicon chip has become the heart of most electronic devices.
silicon chip substrate
During the manufacturing process, the silicon wafer is used as a substrate and undergoes a series of microelectronic process steps such as photolithography, doping, and deposition, resulting in the formation of intricate circuit structures.
These chips have demonstrated great resilience in both commercial and military applications, typically maintaining efficient operation in temperatures ranging from 0 to 70°C, with military-grade chips able to withstand a wider range of temperature conditions. However, once temperatures exceed 200°C, the performance of a silicon chip will drop dramatically and it will not be able to maintain normal operation. The challenge of technology development for higher performance and extreme environmental applications.
In recent years, the semiconductor industry has focused on exploring new substrate materials to meet the tougher challenges and realize performance improvements.
Against this backdrop, glass substrates have emerged as an emerging alternative, attracting increasing attention for their flat surface, high wiring density, excellent thermal stability and electrical performance.
Especially in the field of high-performance computing and artificial intelligence, glass substrates are able to provide superior signaling speed and power efficiency, and support the integration of more transistors in a smaller space, which opens up a new path to break through the limitations of traditional organic substrates.
