The implementation of the multi-layer processing strategy allows the deposition, lithography, etching and other steps to be repeated in a cyclical manner, layer upon layer, ultimately building a complex and sophisticated multi-layer circuit network. When the circuit manufacturing is completed, the testing and cutting stage follows, with electrical testing to ensure that the circuitry on each wafer meets the design requirements, after which the wafer is cut into individual grains along a pre-determined segmentation line, which is what we call a chip in our daily lives. Of particular note is the process of dicing semiconductor wafers, also known as scribing. During this process, both speed and pressure are strictly controlled to minimize damage to the wafer. Once dicing is complete, the wafer is split into multiple grains, each of which has the potential to become an individual chip.