semiconductor wafer fabrication
The journey of a p-type silicon wafer begins with a pure piece of silicon substrate, which is sculpted through multiple precision processes and ultimately transformed into a high-performance electronic product in the hands of the consumer.
After completing a series of nanoscale projects, the wafer is cut into individual chips, each tiny unit harboring enormous computing potential.
semiconductor wafer fabrication
First, through advanced lithography, circuit designs are precisely transferred to the p-type silicon surface. These designs, like miniature city plans, contain billions of electronic components to form complex integrated circuits.
Subsequently, ion-implantation techniques precisely introduce impurities into the p-type substrate to form PN junctions, giving each region specific electrical properties.
Layers of insulating layers with metal interconnects are chemically and mechanically polished to achieve flatness and ensure efficient signal transmission.
