polished sapphire substrates
The sapphire cutting, grinding and polishing process is a complex series of processes for machining sapphire crystals into specific shapes and sizes, as well as achieving high surface quality and optical properties.
polished sapphire substrates
The cut sapphire wafer or part needs to be rough ground to remove surface damage, followed by fine grinding to achieve the desired thickness and flatness. After rough grinding, fine grinding is required to further remove surface roughness.
During fine grinding, finer abrasives and lower grinding forces are used to obtain a smoother surface.
This step is critical to improving the surface quality of the sapphire substrate. The surface of the polished sapphire substrate should be free of scratches, pits, cracks and other defects, and the surface finish and flatness should meet the specified requirements.
Such as abrasive water jet polishing, mechanical grinding and polishing, thermal chemical polishing, and pure chemical polishing are a few of the main polishing methods.
The steps of polishing sapphire substrate include: cutting, rough grinding, fine grinding, and polishing.
