The process of meticulously carving out complex patterns on a wafer begins with the deposition of a uniform silicon film on the surface of the wafer, followed by the use of advanced photolithography techniques to expose the film to specific wavelengths of light and define the contours of the desired pattern through a photomask.
In view of the extreme pursuit of precision and highly specialized technology of the patterning process, semiconductor manufacturing companies often entrust this key link to professional foundries to ensure production efficiency, cost control and technological innovation of the triple advantage.
This cooperation model not only promotes the specialized division of labor in the industry chain, but also accelerates the technological progress and industrial upgrading of the IC industry.