how are wafers made
Through the straight drawing method (CZ) or the cutting-edge floating zone method (FZ) technology, in a precisely controlled temperature gradient and pure environment, the seed crystals are slowly stretched and crystallized, starting with the seed crystals, and ultimately condensing into a perfect monocrystalline silicon column. This process is the ultimate demonstration of the art of temperature and environmental control. The monocrystalline column is precisely cut into thin slices, a process that is given a new lease on life – wafer cutting, where diamond wire saws, with their sharpness and precision, give each wafer its initial form. The surface of the wafer has gone through a magnificent transformation from rough to delicate, grinding and polishing process, not only to remove the traces of cutting, but also gives the wafer a mirror-like smoothness and luster.
how are wafers made
The subsequent cleaning step is another sublimation of the purity of the wafer, ensuring that each piece of the wafer is as pure and flawless as a newborn.
The surface of the wafer is first given a protective oxide layer, and then, through advanced chemical vapor deposition (CVD) technology, a variety of functional films, such as silicon nitride and silicon oxide, are precisely deposited on it, laying the foundation for subsequent circuit construction.
Photolithography and etching technologies, like master sculptors in the microcosm, etch complex circuit structures on wafers according to precisely designed patterns.
Through the ion implantation technology, the wafer is skillfully implanted inside the specific elements, these elements as magic to change the conductivity of the local area of the wafer, the formation of integrated circuits in the key areas.
The heat treatment, like a catalyst in time, not only activates these injected elements, but also repairs any lattice damage that may exist, ensuring the stability and reliability of the circuit structure.
The above steps often need to be repeated several times, and each cycle is another enhancement to the performance of the wafer, and the multilayer IC structure is gradually shaped in the repeated carving.
After rigorous testing and screening, unqualified wafer areas are accurately eliminated, while qualified wafers are cut into independent chips and baptized by encapsulation, eventually becoming indispensable electronic components in our daily lives.
The entire wafer manufacturing process is a constant challenge and breakthrough to the limits of technology, as well as the highest tribute to human wisdom and creativity.
