epitaxial silicon wafer
Epitaxial silicon wafer : Cost-effective: Batch processing reduces the cost of packaging individual chips, especially when produced on large-diameter wafers.
Good heat dissipation performance:, the chip and the external heat exchange is more direct, is conducive to heat dissipation, because the package material is less
epitaxial silicon wafer
Dicing: After packaging, the entire wafer is diced into individual chips.
Application Areas:
Widely used in mobile communications, consumer electronics, IoT devices, high-speed memory, logic devices, sensors, etc., especially in devices that require a high degree of integration and miniaturization.
Development trend:
With technological advances, wafers are developing in the direction of higher density, thinner, and lower cost, and new materials and processes are being explored to meet the higher requirements of 5G, AI, high-performance computing, and other fields.
The innovation of wafer-level packaging technology not only promotes the advancement of semiconductor packaging technology.
but also facilitates the miniaturization and performance enhancement of electronic products, which is an indispensable part of the modern electronics industry.
