cpu silicon wafer
silicon wafer: High transmission speed: Due to the short circuit path, signal delay and loss are reduced, improving data transmission speed and stability.
High-density connections: Thin-film redistribution layer technology allows I/O to be distributed across the entire surface of the chip, rather than being limited to the edges, greatly increasing the density of connections per unit area.
cpu silicon wafer
Process flow of wafer-level chip packaging technology:
Thin film redistribution layer: metal lines are formed on the wafer to redistribute the interfaces of the chip.
Flip Chip: The chip is placed face down and connected directly to the substrate or package material to improve connection efficiency.
Photolithography and etching: Precise circuit patterning ensures the accuracy of electrical connections.
