clean silicon wafer
Cleaning of silicon wafers is a critical and fundamental step in the semiconductor manufacturing process. Ensuring the cleanliness of the wafer surface is essential for subsequent processes such as lithography, deposition and etching.
The aim is to remove chemical and particulate impurities from the wafer surface to ensure the quality of subsequent processes. It is also often referred to as silicon wafer or silicon chip.
clean silicon wafer
The cleaning process flow for silicon wafers usually includes the following key steps: the wafers undergo an initial physical cleaning to remove larger particles and loose contaminants from the surface, which is called pre-cleaning, chemical cleaning, ultrasonic cleaning, ozone cleaning, and drying.
After cleaning, the wafers need to be dried to prevent water damage and recontamination. It also includes: deionized water rinsing, high purity water rinsing, and finally, cleaning effect inspection and storage.
