Wafer-level chip size packaging is an advanced packaging technology, which changes the traditional packaging process, realizing the direct chip packaging in the wafer manufacturing stage.
chip on wafer on substrate
Wafer prices are influenced by multiple factors, including but not limited to size, purity, market supply and demand dynamics, and customization needs. Larger sizes, such as 12-inch wafers, have higher unit prices, but may be more competitive due to higher production efficiencies.
Market prices fluctuate significantly, and it is important to consult with suppliers regularly for the latest quotes and to monitor the global semiconductor supply chain for potential price impacts.
To summarize, wafer procurement is a comprehensive decision-making process that requires comprehensive consideration of technical parameters, cost-effectiveness, supply chain stability and other dimensions to ensure that the project runs smoothly and achieves the desired goals.
