Subsequently, the wafers undergo subsequent treatments such as grinding and polishing to further enhance surface quality and minimize surface defects.

The grinding stage uses boron carbide or diamond liquid with grinding pads to remove uneven and damaged layers generated during the slicing process, while polishing utilizes specific polishing accessories, such as imported Universal Optical Accessories or domestically produced polyurethane polishing cloths with alumina polishing solution, to achieve a mirror-like smooth surface.

The physical properties of sapphire are the indispensable basis for its use in high-tech applications.

It has an extremely high hardness, second only to diamond, which gives it excellent resistance to abrasion and scratches. At the same time, sapphire has excellent chemical stability and is able to maintain its structural integrity in harsh environments.

Its high thermal conductivity, especially at room temperature of around 42 W/m-K, means that it conducts heat efficiently, which is critical for devices that require good thermal management.

In addition, sapphire exhibits good transparency over a wide spectral range (~0.15 μm to 5.5 μm), making it an ideal material for optical windows, lenses and lasers.

C-face sapphire’s excellent coefficient of thermal expansion and thermal conductivity are particularly critical in LED and laser applications. These properties help to improve the thermal management of devices and reduce performance degradation and lifetime reduction due to overheating.

Especially in LED production, C-face sapphire, as a substrate, promotes rapid heat dissipation, which improves the efficiency and stability of LEDs and extends their lifetime.

Therefore, C-face sapphire plays an irreplaceable role in enhancing the thermal performance of LEDs and lasers, and is an indispensable material choice in these fields.