450 mm wafer
Wafers, the core material for semiconductor manufacturing, are prepared from high-purity silicon through a series of precision processes. Silicon is chosen for its desirable semiconductor properties, and the name “wafer” is derived from its unique round shape. In the semiconductor industry, the state of fab operations and its technological advancements are often in the spotlight, especially when referring to 8-inch or 12-inch wafer production lines. These dimensions refer specifically to the diameter of the wafers, corresponding to 200 mm and 300 mm, respectively, and they are important indicators of fab capacity and technology.
450 mm wafer
In the manufacturing process of integrated circuits, wafers play a crucial role, not only as the substrate that carries the patterns of microcircuits, but also as the key to the transition from raw materials to functional electronic products.
Through these efforts, we have not only upgraded the physical dimensions of wafers, but more importantly, increased the density of components per unit wafer, which has significantly increased yields and lowered costs, ensured efficient conversion from silicon wafers to integrated circuit (IC) products with specific electronic functions, and provided a solid foundation for miniaturization and high-performance of electronic devices.
