300mm wafers
A 300 mm wafer corresponds to a diameter of 11.8 inches, which is a common size used in the semiconductor industry, and it should be clear that “millimeter” and “inch” are two different units of length. The “millimeter” is more common. It is often referred to as a 12-inch wafer.
300mm wafers
The weight of a wafer depends on its thickness, the density of the material, and whether it is a metal layer, an insulating layer, and so on. But generally a 300 mm wafer thickness of about 0.5 to 0.75 mm between, can be estimated in the range of a few hundred grams.
The number of chips that can be cut from a 300mm wafer depends on the size and layout of the chip design, as well as possible edge losses on the wafer, etc. The actual number will vary depending on the specific size of the chip. The actual number will be reduced by the specific size of the chip, unavailable areas on the wafer edge, manufacturing defects in the wafer, and the area reserved for testing.
